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High-Energy Picosecond Laser(45W) combine fiber-optic femtosecond seed source and solid-state laser hybrid amplification technology with advanced fiber-solid-state hybrid manufacturing technology, resulting in low thermal impact, stable operation, and a variety of control functions. They are used in semiconductor, photovoltaic, and new energy industries, especially for cutting sapphire, cutting and drilling hard and brittle materials, and scribing and dicing wafers.
Parameters | Unit | Brittle Series-High-Energy Picosecond Laser | |
Operation Mode | / | Pulse | |
Polarization State | / | Vertical | |
Average Power | W | 20kHz 40kHz@5burst | ≥75 |
Central Wavelength | nm | 1064±1 | |
Spectral Width | nm | <0.3 | |
Pulse Width | ps | 10 | |
Max.Pulse Energy | mJ | >3.5 | |
Frequency | kHz | 20-200 | |
Burst | / | 4-10 | |
Spot Quality | M² | <1.3 | |
Beam Diameter | mm | 2±0.2 | |
Power Instability | RMS(%) | 3 | |
Operating Temperature | °C | 20-30 | |
Work | / | 10%-80% | |
Water Cooling Temperature | °C | 22 | |
Weight Of Complete Machine | kg | <90 | |
Rated Power Consumption | W | <2000 |